Application of surfactants in enhancing chemical mechanical polishing slurry performance for microelectronics: A review
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作者
Ma, Song; Chen, Yiwen; Wang, Caoxu; Li, Yan; Xu, Yang; Wu, Yue
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刊物名称
MATERIALS TODAY COMMUNICATIONS
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年、卷、文献号
2025, ,
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关键词
Ma, Song; Chen, Yiwen; Wang, Caoxu; Li, Yan; Xu, Yang; Wu, Yue
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摘要
Chemical Mechanical Planarization (CMP) is a crucial step in semiconductor fabrication, utilizing slurries including abrasives, and chemicals, including oxidizers, inhibitors and surfactants. The application of surfactants significantly enhances planarization efficiency, and minimizes defects. Despite their extensive application, the functional mechanisms remain insufficiently studied in recent advancements. To bridges this gap, this review firstly outlines the performance properties of CMP and slurry, followed by background information of surfactants. It then provides a comprehensive review of the application of surfactants across diverse material systems, with the in-depth analysis of the functional mechanism. Surfactants act as multi-functional additives that optimize mechanical friction and work synergistically with chemical reactions to achieve efficient material removal and high surface planarity. In addition, the synergistic effects between surfactants and other slurry components, followed by the adsorption and surface interaction characteristics, and we conclude by suggesting current insufficiency in the field to guide future innovative research and application.
